THIS DEED OF FAMILY SETTLEMENT is made at…………..on this……….. day of…………..20………….. between the heirs of A namely (i) B, widow of A, (it) C son of A, (fit) D daughter of A, (iv) E son of F, the predeceased second son of A, (v) G widow of the third son of A. WHEREAS (1) [P1]The…

THIS DEED is made at…………..on this…………..day of…………..20………….. between Smt. A widow of B resident of…………..hereinafter called as Smt. A of the FIRST PART, and C son of B resident of…………..hereinafter called as Shri C of the SECOND PART and D son of B resident of ……. hereinafter referred to as Shri D of the THIRD…

THIS DEED of compromise made at………………on this………………day of………………20……… between A son of………………resident of……………….and B son of………………resident of(hereinafter collectively called “the heirs”) of the ONE PART and C son of ……………. resident of………………and D son of………………resident of………..(hereinafter collectively called “the legatees”) of the OTHER PART WHEREAS (1) [P1]One E son of………………resident of………………died leaving the properties and…

THIS DEED OF FAMILY SETTLEMENT is made at……………this…………… day of …………… 20……………between A son of Shri……………resident of… I of the FIRST PART and Smt. B daughter of Shn resident of of the SECOND PART and Shri C son of resident of of the THIRD PART and Smt. D wife of resident of of the FOURTH…

THIS DEED of compromise made at………………on this………………day of………………amongst A son of Shri………………resident of……………… of the ONE PART and B son of Shri……………… resident of………………of the SECOND PART and Smt. C wife of Shri………………resident of………………of the THIRD PART. WHEREAS (1) [P1]On the death of D, son of Shri………………the parties above mentioned claim to be entitled to…

THIS DEED [P1]is made at……………..on this day of……………..20…between A son of …………….resident of……………..(hereinafter called “the Debtor”) of the FIRST PART andB son of ……………..resident of……………..(hereinafter – called “the Trustee”) of the SECOND PART and several persons, firms and companies who have executed this deed, whose names, extent of debts and signatures and seals appear in…

THIS DEED is made at……………..on this……………..day of……………..20………… between Shri……………..Chairman of the creditors, whose names and the amount of whose debts are subscribed and entered in the Schedule hereto (hereinafter called “the appointer”) of the ONE PART and Shri……………..son of……………..resident of……………..(hereinafter called “the new trustee”) of the OTHER PART. WHEREAS (1) This deed is supplemental to…

THIS DEED of compromise is made at………………on this………………day…………… between A son of………………resident of………………(hereinafter called Mr. A) of the ONE PART and B son of………………resident of……………… (hereinafter called Mr. B) of the OTHER PART. WHEREAS (1) Mr. A is the registered proprietor of the patent (hereinafter called the Patent) No ……………… dated………………within India for an invention…

THIS DEED is made at……………..on this……………..day……………..20 between Shri A son of ……………..resident of B son of…………….. resident of…………….. (hereinafter called “the debtors”) of the FIRST PART, C son of……………..resident……………..D son of ……………..resident of…………….. (hereinafter called “the inspectors”) of the SECOND PART and persons, firm, creditors of the debtor, whose names are subscribed to this deed…

I …………….. son of……………..being a creditor of Shri A son of……………..carrying on business of ……………..at……………..for the amount of Rs……………..for the supply of ……………..agree to accept the proposal of the said A for a composition contained in a notice to the creditors dated……………..with such modifications, as may be agreed by the creditors at a meeting to…